Statistical Analysis of Adhesive Bond Parameters in a Single Lap Joint System

(Pages 53-58)

Asraar Anjum1, Jaffar Syed Mohamed Ali1, Jalal Mohamed Zayan1 and Abdul Aabid1,2

1Department of Mechanical Engineering, Faculty of Engineering, International Islamic University Malaysia 53100, Kuala Lumpur, Malaysia and 2Engineering Management Department, School of Engineering, Prince Sultan University, Riyadh, Saudi Arabia




Abstract: The design and sizing of adhesives used for bonding of two or more similar/dissimilar materials in aerospace and automobile structural engineering studies have always been important. A vast number of studies have reported via experimental, numerical, and analytical methods of lap joint system with adhesive bonding. Optimization studies of the adhesives used in joints are highly necessary which can be done either with numerical or experimental data in determining the suitable parameters for the specified solution through the design of experiments analysis. In this study, a single lap joint with different variables has been modelled and the resulting stress was measured in each case. A standard two-dimensional plane stress element was used for modelling of single lap joint stress elements. Furthermore, a statistical analysis method was used to optimize the selected parameters for the improvement of current solutions with suitable parameters. The results showed that the response values of stresses were influenced by input parametric variables which control the stresses and reduces the risk of damage to the adhesive bonds used in the joints. Moreover, based on the present optimization results it has been found that the thick adhesive bond will result in higher shear stress transfer with less width and suitable for the lower applied voltage.

Keywords: Lap joint, FE Method, DOE, Adhesive bond.